Tokuyama Ee-Bond - Intro Kit

Tokuyama Ee-Bond - Intro Kit

Tokuyama

Availability: Sold out

Bonding Agent
New Rs. 6500
Rs.6,500.00

EMI starts from Rs.315.16   View Plans >

Description

Details

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

 

Indications

Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

 

Indications

Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair

Features
  • Outstanding adhesion performance
  • Dependable marginal integrity (Minimized micro-leakage)
  • Reduced post-operative sensitivity
  • Perfect cavity sealing
  • Less technique sensitivity
  • Prolonged working time
  • Fluoride releasing
packaging
  • EE-BOND Bottle / 5mL
  • Applicator x 25
  • Dispensing well
  • TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
  • Syringe Tip x 10
Additional Information

Additional Information

Dispatch Date Next Day
COD Yes
Reviews

Hot Selling

There are no products matching the selection.

Related Products

There are no products matching the selection.

Recently Viewed Products