Tokuyama Ee-Bond - Intro Kit

Tokuyama Ee-Bond - Intro Kit

Tokuyama

Availability: Sold out

Bonding Agent
New Rs. 6500
Rs.6,500.00

EMI starts from Rs.315.16   View Plans >

Description

Details

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

 

Indications

Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair

TOKUYAMA® EE-BOND is a dental adhesive system formulated for the enamel-etching technique. Utilizing Tokuyama's 3D self-reinforcing (SR) monomer, TOKUYAMA® EE-BOND chemically bonds to both enamel and dentin forming a durable 3D matrix bonding layer. This thin but durable bonding layer offers long-term marginal integrity of the esthetic restoration as well as exceptional dentinal sealing.

 

Indications

Bonding of light- or dual-cured composite to:
1. cut/uncut enamel
2. cut/uncut dentin
3. fractured porcelain/composite repair

Features
  • Outstanding adhesion performance
  • Dependable marginal integrity (Minimized micro-leakage)
  • Reduced post-operative sensitivity
  • Perfect cavity sealing
  • Less technique sensitivity
  • Prolonged working time
  • Fluoride releasing
packaging
  • EE-BOND Bottle / 5mL
  • Applicator x 25
  • Dispensing well
  • TOKUYAMA ETCHING GEL HV Syringe / 2.5mL
  • Syringe Tip x 10
Additional Information

Additional Information

Dispatch Date Next Day
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